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MMC series memory cards are all compact in size and has excellent performance. With years of development, it is now even smaller, and has faster transfer speed.

Many flash memory now are made in the form of QLC, but it can simulate the performance of TLC to achieve better writing performance. So, it can still be used on some enterprise level SSDs.

The market share of all flash memory has dropped in last year, so it was outperformed by HDD/hybrid storage. However, with the launch of many products with high cost performance, it is predicted that all-flash memory will bounce back from its failure.

JEDEC Solid State Technology Association released the final specification of DDR5 SDRAM standard today. The specification increases the memory size and transmission speed.

NEO Semiconductor released a new X-NAND flash memory structure. The structure is based on tradition NAND structure so it can be applied at a low cost. This structure allows larger capacity and faster speed.

US Department of Commerce recently sent a warning to the major makers of semiconductor equipment. forbidding the export of 14nm manufacturing equipment to China

Operating profit of 4.193 trillion won, net profit of 2.877 trillion won, combined sales of 13.811 trillion won.

Major memory chip manufacturer Micron recently declared that scale production of its 232-layer NAND flash memory chip had begun. The solid-state memory chip in question is the first in the world to have more than 200 layers.

176-layer technology is now

According to an ET report of August 4, Yangtze Memory Technology Co., Ltd. (YMTC), a Chinese chip manufacturer, introduced a new memory chip technology on August 3 that will help it catch up to competitors like Micron and SK Hynix. While Washington is cont